CanSat

Description

This is the PCB I am most proud of. It is the main PCB of the CanSat that participated in the 2023 edition of RCRC (Rocketry Challenge Romania Cup). The design contains a lot of things tightly packed together, demonstrating advanced PCB layout and design expertise.

This project required extensive research and careful planning to integrate so many components into a compact form factor. The power management system uses high-efficiency converters to minimize energy waste, crucial for a balloon-based payload. The sensor integration demonstrates knowledge of various communication protocols including I2C, SPI, UART, and RS485.

Key Features

• 2 synchronous step-down switch mode converters (3.3V and 5V)
• Advanced microcontroller with extensive connectivity
• LoRa Module for long-range communication
• microSD connector for data logging
• Comprehensive sensor suite:
  • Temperature, humidity, pressure sensors
  • 6-axis IMU (Inertial Measurement Unit)
  • Particulate matter sensor
  • CO₂ sensor
• Connectivity for GPS module
• GSM module connector
• Buzzer output
• Solar irradiance sensor
• RS485 soil sensor interface
• 4 analog inputs for gas sensors (SO₂, NO₂, CO, UV light)

Design Highlights

Technical Challenges

The main challenge was fitting all the required functionality into a compact PCB while maintaining signal integrity. This was solved through careful layer stackup planning, strategic component placement, and extensive use of surface mount technology.

Design Tools

• KiCad
• Mathcad
• VS Code
• Fusion 360

Learning Outcomes

Tools & Technologies:
EDA: KiCad; Design: four-layer PCB; MCU: STM32; Other: digital & analog electronics; Manufacturing: JLCPCB.

This project required extensive research and careful planning to integrate so many components into a compact form factor. The sensor integration demonstrates knowledge of various communication protocols including I2C, SPI, UART, and RS485.